| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered circuit board having a columnar conductor for interlayer conduction wherein an interlayer insulating layer uses an electrodeposition resin by the electrodeposition method, and to provide a manufacturing method thereof. <P>SOLUTION: A precipitation mask at the electrodeposition is formed at a part on a copper foil 1 of the part acting like an interlayer connection part 2 by a conventional exposure development process by using a dry film resist 3, and the electrodeposition resin serving as the interlayer insulating layer 4 is precipitated on the exposed face of the copper foil 1 by the electrodeposition method. At that stage, the dry film resist 3 is exfoliated to from the opened interlayer connection part 2. Then, after the columnar conductor 5 is formed on the interlayer connection part 2 by the plating method by using the interlayer insulating layer 4 for a mask, a copper foil 6 is uniformly layered on the interlayer insulating layer 4 and the columnar conductor 5, and required wiring layers 7, 8 are simultaneously formed to the copper foils 1, 6 on both sides by the subtractive method. Then the interlayer insulating layer attached copper foil with the columnar conductor formed by the method above is layered from both sides, and other required wiring layers 9, 10 are formed by the subtractive method to manufacture the multilayered circuit board. <P>COPYRIGHT: (C)2004,JPO</p> |
