发明名称 MANUFACTURING PROCESS OF RESIN MOLDED ARTICLE AND THERMOFORMABLITY EVALUATION METHOD OF RESIN BOARD
摘要 PROBLEM TO BE SOLVED: To manufacture a molding which has less thickness unevenness and a good shape even at a curved portion. SOLUTION: The resin molding is manufactured by selecting a resin board having a degree of gelation of 30-100%, a molecular weight between crosslinking points (Mc) measured by a swelling method in the range of 10<SP>4</SP>-10<SP>5</SP>g/mol, a Mooney-Rivlin parameter ratio (2C<SB>2</SB>/2C<SB>1</SB>) of 2.5 or less, and a degree of strain hardening (dlnΛ/dε) in a uniaxial elongational flow of 0.7 or more and by thermoforming this. Regarding a board of a thermoplastic resin such as poly(methyl methacrylate), there are determined the degree of gelation and the molecular weight between crosslinking points (M<SB>c</SB>) by the swelling method and there are further determined the Mooney-Rivlin parameter ratio (2C<SB>2</SB>/2C<SB>1</SB>) and the degree of strain hardening (dlnΛ/dε) in the uniaxial elongational flow, and the resin board in which these values satisfy the above requirements is judged to have good thermoformability. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004142424(A) 申请公布日期 2004.05.20
申请号 JP20030206229 申请日期 2003.08.06
申请人 SUMITOMO CHEM CO LTD 发明人 OGURA KOJI
分类号 B29C51/00;B29C51/26;B29K23/00;B29K33/04;(IPC1-7):B29C51/00 主分类号 B29C51/00
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