| 摘要 |
PROBLEM TO BE SOLVED: To reduce a defect such as a void and wire deformation at the time of resin-sealing a chip mounted on a substrate and to easily treat and effectively use a resin material. SOLUTION: In a resin sealing method, the substrate 13 is placed on a substrate placing part 10 in a state where a lower mold 1 and an upper mold 2 are opened, a resin sheet 6 is placed on a mold face of a cavity 3. A heater 9 heats the resin sheet 6 and generates molten resin 17. A movable member 5 is raised until an upper face of the molten resin 17 becomes almost similar to the mold face of the lower mold 1. The upper mold 2 is lowered while the atmosphere between the lower mold 1 and the upper mold 2 is sucked via a gas pass 8 so as to tighten them. A chip 14 and a wire 15 are immersed in molten resin 17. Molten resin 17 is cured, and cured resin is formed. A mold product of the substrate 3 and cured resin is formed, and the lower mold 1 and the upper mold 2 are opened and molded product is taken out. Since the molten resin 17 viewed from the substrate 13 uniformly flows in a depth direction of the cavity 3 in a short time, the void and wire deformation can be prevented. COPYRIGHT: (C)2004,JPO |
