| 摘要 |
A patch antenna includes a dielectric substrate having a through-hole, a patch electrode on the dielectric substrate, and a feed pin inserted in the through-hole. A head of the feed pin is soldered to the patch electrode. The bottom surface of the head of the feed pin has projections for generating a clearance between the bottom surface of the head and the opposing surface of the patch electrode, which is filled with a solder. The solder can function as a cushion that prevents a thermal contraction or a thermal expansion of the head of the feed pin to directly affect the dielectric substrate.
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