SEMICONDUCTOR DEVICE HAVING PACKAGE STRUCTURE FOR PREVENTING WIRE SWEEPING AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device having a package structure for preventing wire sweeping and its manufacturing method are provided to easily form a micro pattern or a complex package by fixing a wire using an insulating material dispense and a cure process. CONSTITUTION: A semiconductor device having a package structure for preventing wire sweeping is provided with bonding wires for electrically connecting the pads of a semiconductor chip with a lead frame(150), and a dispense path(158) for fixing the bonding wires by connecting insulation material to predetermined portions of the bonding wires. The semiconductor device further includes a molding compound part for selectively enclosing and insulating the resultant structure.