| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light emitting device that does not make malfunctions and is improved in yield and reliability by making a laminated semiconductor section and a conductive substrate uniformly stickable to its whole surface and can highly efficiently emit light to the outside. <P>SOLUTION: For example, the laminated semiconductor 10 is formed and, at the same time, a metallic layer 21 is provided on the adhesive surface side thereof. Then a conductive substrate 1 and a bonding metallic sheet 2 press-bonded to the layer 21. The metallic sheet 2 uses a low-melting point metal having a thickness of ≥10μm. <P>COPYRIGHT: (C)2004,JPO |
