发明名称 COMPOUND SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor substrate having a semiconductor part of a superior characteristic similar to a case when it is formed in an off substrate generated by inclining a face orientation without previously inclining the substrate from the prescribed face orientation and cutting it. <P>SOLUTION: The substrate has a region forming a principal surface 102 of a silicon substrate 101 and a region forming a slope 104 where a direction inclined by an inclination angle 103 of 1&deg; to 10&deg; against a normal direction of the main surface 102 is set to be the normal direction. A compound semiconductor layer 107 whose crystal structure differs from the silicon substrate 101 is formed on the region where the slope 104 is formed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146571(A) 申请公布日期 2004.05.20
申请号 JP20020309401 申请日期 2002.10.24
申请人 SHARP CORP 发明人 ISHIMARU MASAAKI
分类号 C30B25/18;C30B29/38;H01L21/02;H01L21/205;H01L33/16;H01L33/32;H01L33/34 主分类号 C30B25/18
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