发明名称 INSULATING COATING CONDUCTIVE PARTICULATE AND CONDUCTIVE CONNECTION STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an insulating coating conductive particulate which can prevent leak between adjoining electrodes and has a small connection resistance and is superior in connection reliability. <P>SOLUTION: This is an insulating coating conductive particulate which is made of a spherical core member particle having an average particle size of 1-20μm, a conductive metal coating layer formed on the surface of the spherical core member particle, and an insulating resin layer formed on the surface of the conductive metal coating layer. The average coating ratio of the insulating resin layer is 5-60% and the standard deviation of the coating ratio of the insulating resin layer is 1-15%, and the insulating coating conductive particulate which has the insulating resin layer with an coating ratio of less than 8% is contained 1-10%. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004146261(A) 申请公布日期 2004.05.20
申请号 JP20020311517 申请日期 2002.10.25
申请人 SEKISUI CHEM CO LTD 发明人 YONEDA YOSHIKAZU
分类号 C09C3/06;H01B1/00;H01B1/22;H01B5/00;H01B5/16;H01R4/04;H01R11/01;(IPC1-7):H01B1/00 主分类号 C09C3/06
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