发明名称 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
摘要 The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
申请公布号 US2004096676(A1) 申请公布日期 2004.05.20
申请号 US20030468115 申请日期 2003.08.15
申请人 SAKAYORI KATSUYA;MOMOSE TERUTOSHI;TOGASHI TOMOKO;KAWANO SHIGEKI;UCHIYAMA MICHIAKI;OKAMURA KAZUTO;TAGUCHI KAZUTOSHI;OHMIZO KAZUNORI;SHIMOSE MAKOTO 发明人 SAKAYORI KATSUYA;MOMOSE TERUTOSHI;TOGASHI TOMOKO;KAWANO SHIGEKI;UCHIYAMA MICHIAKI;OKAMURA KAZUTO;TAGUCHI KAZUTOSHI;OHMIZO KAZUNORI;SHIMOSE MAKOTO
分类号 B32B15/08;B32B15/088;B32B15/18;B32B15/20;G11B5/48;H01L21/306;H01L23/12;H05K1/03;H05K1/05;H05K3/00;H05K3/38;(IPC1-7):B32B15/08 主分类号 B32B15/08
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