发明名称 |
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
摘要 |
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes. |
申请公布号 |
US2004094601(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20030700438 |
申请日期 |
2003.11.04 |
申请人 |
HAZEYAMA ICHIRO;KITAJO SAKAE;SHIMADA YUZO;KATAHIRA AKEO;ISHIDA JUN;TERASHIMA MASARU;FUTAKAMI KAZUHIKO |
发明人 |
HAZEYAMA ICHIRO;KITAJO SAKAE;SHIMADA YUZO;KATAHIRA AKEO;ISHIDA JUN;TERASHIMA MASARU;FUTAKAMI KAZUHIKO |
分类号 |
H01L21/48;H01L21/60;H01L21/683;H05K3/34;(IPC1-7):B23K1/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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