发明名称 Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben
摘要 The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.
申请公布号 DE10229542(B4) 申请公布日期 2004.05.19
申请号 DE2002129542 申请日期 2002.07.01
申请人 INFINEON TECHNOLOGIES AG 发明人 WENNEMUTH, INGO;THOMAS, JOCHEN
分类号 H01L23/31;H01L23/495;H01L23/498;H01L23/552 主分类号 H01L23/31
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