| 摘要 |
<p>The circuit board has a metal layer applied to its underside, with HF components (11,12) for the microwave circuit mounted on its top surface, coupled to other HF components via microstrip lines (13,14) and to a DC source via current leads (20). The area of the metal layer underlying at least one HF component (11) is separated from the remainder of the metal layer by a gap (16), to form an island (17) below the microstrip lines (13).</p> |
