Device manufacturing method with reversed alignment markers

摘要

A device manufacturing method comprising the steps of: providing a first substrate having first and second surfaces; patterning said first surface of said substrate with at least one reversed alignment marker; providing a protective layer over said alignment marker(s); bonding said first surface of said first substrate to a second substrate; locally etching said first substrate as far as said protective layer to form a trench around the or each reversed alignment marker; and forming at least one patterned layer on said second surface using a lithographic projection apparatus having a front-to-backside alignment system whilst aligning said substrate to the alignment markers revealed in the or each trench. <IMAGE>