发明名称 |
Heat sink for a computer processor, has an arrangement of heat conducting pipes and heat dissipating walls and adapters that provide very efficient heat removal |
摘要 |
<p>A cooling device with heat conducting tubes, or heat pipes for a processor (6) mounted on a system board (7). The device comprises one or more heat transfer and dissipation bodies that are made up of multiple sections and have heat deflecting and transferring adapter systems (5,10) and one or several large surface cooling walls (1) with or without integral cooling ribs (2) and or fins and a number of heat pipes.</p> |
申请公布号 |
DE202004003783(U1) |
申请公布日期 |
2004.05.19 |
申请号 |
DE20042003783U |
申请日期 |
2004.03.11 |
申请人 |
RICHARD WOEHR GMBH |
发明人 |
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分类号 |
F28D15/02;G06F1/20;H01L23/427;(IPC1-7):H05K7/20;F28D15/00 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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