发明名称 Heat sink for a computer processor, has an arrangement of heat conducting pipes and heat dissipating walls and adapters that provide very efficient heat removal
摘要 <p>A cooling device with heat conducting tubes, or heat pipes for a processor (6) mounted on a system board (7). The device comprises one or more heat transfer and dissipation bodies that are made up of multiple sections and have heat deflecting and transferring adapter systems (5,10) and one or several large surface cooling walls (1) with or without integral cooling ribs (2) and or fins and a number of heat pipes.</p>
申请公布号 DE202004003783(U1) 申请公布日期 2004.05.19
申请号 DE20042003783U 申请日期 2004.03.11
申请人 RICHARD WOEHR GMBH 发明人
分类号 F28D15/02;G06F1/20;H01L23/427;(IPC1-7):H05K7/20;F28D15/00 主分类号 F28D15/02
代理机构 代理人
主权项
地址