MODUL FÜR INTEGRIERTE SCHALTUNGEN MIT STRESSREDUZIERENDEN FEDERKONTAKTEN VON MINDESTENS ZWEI VERSCHIEDENEN TYPEN

摘要

An electromechanical module (10) is comprised of an electronic component (11) that is attached to a substrate (12) which is bendable. Multiple springy contacts (14a and 14b) touch respective I/O pads (12d) on the substrate. A compressing mechanism (16-19) compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type (14a), each of which exert a relatively small force against its respective I/O pad; and contacts of a second type (14b), each of which exert a substantially larger force against its respective I/O pad.