Method of forming a via hole through a glass wafer

摘要

A method of forming a via hole through a glass wafer includes depositing a material layer (110) on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer (200), forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole (130), eliminating any remaining patterning material (120) used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole (130) is etched to form a via hole (130') having a smooth surface and extending through the glass wafer, and eliminating the material layer (110). The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.