发明名称 |
Workpiece carrier retaining element |
摘要 |
A wafer carrier retaining ring includes a first annular surface that contacts a polishing surface during a polishing process and an inner diameter surface adjoining the first annular surface thereby forming a first annular corner. The first annular corner has a radius in the range of from no less than about 0.010 inches to less than a radius that would result in damage to a wafer being polished. In another embodiment of the invention, a wafer carrier retaining ring includes an inner diameter surface and a second annular surface adjoining said inner diameter surface thereby forming a second annular corner. The second annular corner has a radius of no less than 0.030 inches. In a further embodiment of the invention, a wafer carrier retaining ring is formed of a ceramic material and has a first annular surface having a surface finish of no greater than 2 microinches rms.
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申请公布号 |
US6736713(B2) |
申请公布日期 |
2004.05.18 |
申请号 |
US20010924067 |
申请日期 |
2001.08.07 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
LOUGHER WAYNE F.;MCPEEK FRANK;KEY ROBERT |
分类号 |
B24B37/04;B24B41/06;(IPC1-7):B24B7/00;B24B9/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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