| 摘要 |
Disk substrates are polished in a process which uses a single load of the disks to a polishing apparatus and a single polishing slurry. Preferably, the process varies at least one polishing parameter at multiple stages to achieve both a reasonable rate of removal during one stage and a smooth finished surface during another stage. Preferably, a fine grit cerium oxide slurry is used, along with a polishing pad having surface characteristics intermediate those of relatively hard pads typically used for material removal, and of relatively soft pads typically used for fine finishing. The polisher operates at high pressure and speed during a material removal stage, and then reduces speed and pressure during a finishing stage to achieve a suitable surface finish, without removing and cleaning disks between the two stages.
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