发明名称 |
Anisotropic etching of a semiconductor device using tilted etching holes |
摘要 |
A semiconductor device is provided that simplifies wiring pattern and is capable of being etched through an etching hole as a concavity is produced over a short time period. A dielectric film 12 is formed so as to shield the concavity formed upon the upper surface of a silicon substrate 10. A circuit pattern that has a thermoelectric conversion element 18 is formed upon the dielectric film. The upper surface of the silicon wafer becomes a (100) surface, and a first etching hole 16 extending in the <110> direction of the silicon substrate and a second etching hole 17 extending in the <-110> direction are formed. These holes intersect in a cross shape. Shapes of the first and second etching holes become parallelograms which have oblique sides tilted with respect to <110> and <-110>. Imaginary rectangles passing though the vertices of the first and second etching holes are continuous. As a cross shape is removed from the silicon substrate, etching is rapid due to the appearance of (411) surfaces at the intersecting part. |
申请公布号 |
US6737729(B2) |
申请公布日期 |
2004.05.18 |
申请号 |
US20010001214 |
申请日期 |
2001.10.23 |
申请人 |
OMRON CORPORATION |
发明人 |
SHIINOKI MASAKAZU;SAKURAI KENJI;FUJII MITSURU |
分类号 |
H01L21/306;B81C1/00;G01J1/02;G01P5/12;H01L35/00;(IPC1-7):H01L29/82 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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