发明名称 |
Method and apparatus for using tool state information to identify faulty wafers |
摘要 |
A method for identifying faulty wafers includes processing a set of wafers in a tool; collecting tool state information during the processing of the set of wafers; generating a tool state information baseline; comparing the tool state information for each wafer to the tool state information baseline to identify any wafers with outlying tool state information; and designating a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer. A processing line includes a tool adapted to process a set of wafers, and a process controller. The process controller is adapted to collect tool state information during the processing of the set of wafers, generate a tool state information baseline, compare the tool state information for each wafer to the baseline tool state information to identify any wafers with outlying tool state information, and designate a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer.
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申请公布号 |
US6738731(B1) |
申请公布日期 |
2004.05.18 |
申请号 |
US20010815445 |
申请日期 |
2001.03.22 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
RILEY TERRENCE J.;WANG QINGSU;SCHEID GLEN W.;KNOX KENT F. |
分类号 |
G01R31/28;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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