发明名称 Nonoparticles formed with rigid connector compounds
摘要 The present invention relates to a novel organosilicon particle having the formula SiaObCcHd. The particle may be coated with an organic film, preferably a rigid connector compound. The present invention also provides a method of using the organosilicon particle and/or rigid connector compound in the formation of a low-k dielectric film.
申请公布号 US6737107(B2) 申请公布日期 2004.05.18
申请号 US20030408570 申请日期 2003.04.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GATES STEPHEN MCCONNELL;MURRAY CHRISTOPHER BRUCE
分类号 C08K9/04;(IPC1-7):B05D7/00;B05D7/24 主分类号 C08K9/04
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