发明名称 |
METHOD FOR APPLYING PLATING OF IRIDIUM, PLATINUM OR ALLOY THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To inexpensively and easily apply plating of iridium, platinum or the alloy thereof. SOLUTION: A plating solution comprising iridium trichloride, hexa chloroplatinic, amidosulfuric acid and sodium nitrate is prepared. The concentration of hydrogen ions (pH) in the plating solution is controlled to about 1 to 3, the temperature of the plating solution is kept to 60 to 90°C while performing stirring with a magnetic stirring rod, and the current density of the cathode is controlled to 1 to 3 A/dm<SP>2</SP>. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004137523(A) |
申请公布日期 |
2004.05.13 |
申请号 |
JP20020301174 |
申请日期 |
2002.10.16 |
申请人 |
NATIONAL INSTITUTE FOR MATERIALS SCIENCE |
发明人 |
GO YUTAKA;MURAKAMI HIDEYUKI;HARADA KOJI;MITARAI YOKO;YAMAMOTO YOSHINOBU |
分类号 |
C25D3/50;C25D3/56;(IPC1-7):C25D3/50 |
主分类号 |
C25D3/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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