| 摘要 |
PROBLEM TO BE SOLVED: To carry out completely both rough grinding and polishing required for an edge of a work by one chucking action on one work installing base, to eliminate accumulation of errors in centering of the work caused by rechucking, and to evenly and uniformly finish polishing, which is highly accurate and generates extreme smoothness mainly for a semiconductor wafer such as a silicon wafer. SOLUTION: A polishing device for the edge of the work comprises: the work installing base 9 configured to chuck the work 18 that is mainly the semiconductor wafer such as the silicone wafer; and a plurality of wheels 11, 12, 13, 14 which have various polishing characteristics for carrying out rough grinding or finish polishing for the edge 18a of the work 18 installed on the work installing base 9, and for performing these processings with one chucking action for the work installing base 9. COPYRIGHT: (C)2004,JPO
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