发明名称 Semiconductor wafer aligment device has reception plane of alignment table lying within periphery of semiconductor wafer for preventing damage by contact with table edge
摘要 The alignment device (10) has a table (11) which rotates in a plane, provided with a wafer reception plane (12A) and displaced along orthogonal axes via a displacement mechanism (30), with a sensor (50) detecting the position of the wafer edge. The reception plane lies within the periphery of the wafer (W), a reception part (15) on the outside of the table lying in the same plane and having a surface which projects beyond the wafer.
申请公布号 DE10349694(A1) 申请公布日期 2004.05.13
申请号 DE20031049694 申请日期 2003.10.24
申请人 LINTEC CORP., TOKIO/TOKYO 发明人 KUROKAWA, SHUJI
分类号 B23Q17/24;B23Q1/52;B23Q3/18;H01L21/68;H01L21/683;(IPC1-7):B23Q3/18;B23Q3/00 主分类号 B23Q17/24
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