| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve that there are conventionally problems such as a lack of durability, like the deterioration of the mounted state of a semiconductor element due to the fact that the coefficients of thermal expansion of an insulating layer and the semiconductor element are largely different in a wiring board having the insulating layer comprising a compound material of an organic resin and an inorganic filler. <P>SOLUTION: A multilayer wiring board 1 is formed by stacking an insulating layer 2 comprising a compound material with an inorganic filler and an organic resin mixed evenly and a conductor circuit 3 comprising a low-resistance metal in multilayer. The inorganic filler contained in the inner insulating layer 5 is roughly spherical powder, and the inorganic filler contained in the insulating layer 4 in the outermost layer is a woven fabric. Moreover, the coefficient of thermal expansion of the insulating layer 4 in the outermost layer is lower than the coefficient of thermal expansion of the inner insulating layer 5. <P>COPYRIGHT: (C)2004,JPO</p> |
