| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board having good electrical characteristics by realizing the shrinkage of interconnections and the reduction in diameter of IVHs at a low cost. <P>SOLUTION: A method of manufacturing the printed wiring board comprises processes of forming a conductor circuit by pattern electroplating, with a metal foil 8 on top of insulation resin as a power supply layer, the thickness of the metal foil being 2.0μm or below; and forming a hole 10 for interlayer connection by first forming a mask hole on the top of the metal foil and then irradiating a laser beam thereon. <P>COPYRIGHT: (C)2004,JPO</p> |
