发明名称 HEAT RADIATION STRUCTURE OF ELECTRONIC COMPONENT AND DISK DRIVE DEVICE COMPRISING IT
摘要 PROBLEM TO BE SOLVED: To provide a disk drive device comprising a heat radiation structure for an IC in which workability is improved and manufacturing cost is reduced due to material cost reduction. SOLUTION: This device is provided with an IC 10 whose heat should be radiated, a printed board 5 containing a mounting surface on which the IC 10 is mounted, and a metal-made bottom cabinet 2a which is positioned on a mounting surface side of the printed board 5 while positioned with a specified interval from the printed board 5. The bottom cabinet 2a has a protruding part 2a1 formed at a position corresponding to the IC 10 so as to protrude toward the printed board 5. An insulating sheet 6 having an opening 6a at a position corresponding to the protruding part 2a1 is pasted on a surface of the bottom cabinet 2a facing the printed board 5. Between the bottom cabinet 2a and the IC 10, a heat radiation sheet 7 pressurized and fixed by sandwiching with the protruding part 2a1 and the IC 10 is positioned. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140289(A) 申请公布日期 2004.05.13
申请号 JP20020305803 申请日期 2002.10.21
申请人 FUNAI ELECTRIC CO LTD 发明人 MIYAMOTO TAKASHI
分类号 H05K7/20;H01L23/36;H01L23/40;(IPC1-7):H01L23/40 主分类号 H05K7/20
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