发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus which continuously and stably grows dielectric films of the same composition while successively exchanging a plurality of substrates in sputtering the dielectric films containing a plurality of compositions. SOLUTION: According to one embodiment, the sputtering apparatus is provided with grounding counter electrodes disposed around a substrate holding section in a vacuum chamber, and the grounding counter electrodes has, in the surfaces of the counter electrodes facing the targets, a plurality of openings which extend toward the deep parts of the counter electrodes while inclining at an angle 10 to 70°with respect to the direction perpendicular to the target surface. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004137534(A) 申请公布日期 2004.05.13
申请号 JP20020302165 申请日期 2002.10.16
申请人 FUJITSU LTD 发明人 FUJIKI MITSUSHI;MIHARA SATOSHI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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