发明名称 HEAT DISSIPATING DEVICE
摘要 A heat dissipating device includes a housing and a fan unit. The housing has a top wall, a bottom wall opposite to the top wall, and a lateral wall that interconnects the top and bottom walls. Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough. The fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.
申请公布号 US2004090743(A1) 申请公布日期 2004.05.13
申请号 US20020331487 申请日期 2002.12.31
申请人 COMPAL ELECTRONICS, INC. 发明人 CHUANG WEI-PIN;CHENG CHIH-CHUAN
分类号 G06F1/20;H05K7/20;(IPC1-7):H05K5/00 主分类号 G06F1/20
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