| 摘要 |
PURPOSE: A flip chip loading method using a solder-fill is provided to be capable of improving the reliability of a semiconductor package and simplifying the manufacturing process. CONSTITUTION: A PCB(Printed Circuit Board) is prepared for loading a flip chip. A solder-fill is then aligned at the flip chip loading position of the PCB. The solder-fill is attached to the flip chip loading position. A semiconductor chip is then aligned on the solder-fill(C2). A reflow process is performed on the resultant structure(C3). Preferably, the solder-fill is a foil type structure for matching solder bump material and under-fill material to the semiconductor chip and PCB. Preferably, an adhesive part is used for attaching the solder-fill to the PCB.
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