| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can suppress deterioration of a resin used in the light emitting device while improving the heat dissipation efficiency of a light emitting chip, and has a rational structure suited for a practical use. <P>SOLUTION: A light reflecting layer 27 is formed in a recess 2a so as to cover the side face of the chip 26. Herewith, since excitation light such as ultraviolet light reflected by a phosphor layer 32 is reflected again by the light reflecting layer 27, the light does not reach a resin layer 21, resulting in suppressing deterioration of the resin. Simultaneously, since the light reflecting layer 27 covers the side face of the chip 26, the heat generated by the chip 26 can be transferred efficiently to a metal substrate 20 via the resin layer 21 to improve the heat dissipation efficiency of the chip 26. <P>COPYRIGHT: (C)2004,JPO |
