SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE, AND PROCESS FOR FABRICATING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor module having a shape capable of dealing flexibly with a bending stress being applied, and to provide a process for fabricating a semiconductor device and a process for fabricating a semiconductor module. SOLUTION: An element forming layer 2 having a region 3 in which a semiconductor element is formed is provided on the surface of a silicon substrate 1. A trench 4 is formed within the thickness of the silicon substrate 1 at part on the rear surface thereof corresponding to a region of the element forming layer 2 where the semiconductor element is not formed. COPYRIGHT: (C)2004,JPO