| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module in which an electrically and thermally conductive connection part formed between at least one power semiconductor element and a substrate and/or a thermally conductive connection part to a heat sink has a decreased thermal resistance and an electric resistance if necessary. SOLUTION: At least one power semiconductor element (4) is connected to a metal layer (3) by using a layer composed of a carbon minute tube (6) extended substantially perpendicular to a substrate surface, and/or a substrate (2) is connected to a base plate (1) or a cooling body (1) by using a layer composed of carbon minute tubes (5, 8). COPYRIGHT: (C)2004,JPO |
