| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing material exhibiting excellent adhesive force to a surface layer covered with a metallic material such as copper, silver, gold and gold/palladium. SOLUTION: The resin composition consists essentially of (A) a phenolic disulfide compound represented by general formula (21), (B) an epoxy resin, (C) a curing agent and (D) an inorganic filler, regulated so that the proportion of the phenolic disulfide compound of the component (A) is 0.1-15 wt.% based on the epoxy resin. COPYRIGHT: (C)2004,JPO |
