| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the constitution of a multilayer wiring board free of wrinkles and bending back and so on in the vicinity of the edges of a wiring layer in a lamination process, wherein a backing member is laminated on a core substrate including the wiring layer formed thereon to fabricate the multilayer wiring board. <P>SOLUTION: The flexible multilayer wiring board, is made such that a backing member including a copper foil formed on one surface of a resin film and a bonding layer formed on the other surface of the same is laminated on the wiring layer of the core substrate to form an insulating layer and a conductor layer, and the conductor layer is patterned to form the wiring layer. In the multilayer wiring board, when the pattern interval between the wiring layers is 500μm or larger, a dummy pattern is disposed at least at one position between the wiring layers, to eliminate the existence of any gap of at least 500μm between the wiring layers. Further, a small hole, penetrating the dummy pattern, is provided in the dummy pattern. <P>COPYRIGHT: (C)2004,JPO</p> |
