PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a package for housing semiconductor element that is improved in transmission characteristic by effectively preventing the reflection etc., of high-frequency electric signals at the connections between second wiring conductors and the wires of a connector, and to provide a semiconductor device. SOLUTION: This package for housing semiconductor element comprises a substrate 1 having a mounting section 1a for mounting a semiconductor element 6, grounding wiring conductors 2b and first wiring conductors 2a formed on the substrate 1, and grounding pads 3b and input-output pads 3a electrically connecting to the wiring conductors 2b and 2a. This package also comprises second wiring conductors 4 formed on the substrate 1 and a connector 5 which is composed of conductive wires 5a and an insulating enclosing body 5b and in which the wires 5a are electrically connected to the second wiring conductors 4. The longitudinal cross-sectional areas S1of the second wiring conductors 4 and those S2of the conductive wires 5a of the connector 5 are adjusted to meet the inequality of 0.3≤S1/S2≤1.2. In addition, the conductors 4 are connected to the wires 5a of the connector 5 in a state where the end faces of the conductors 4 and wires 5a are faced to each other. COPYRIGHT: (C)2004,JPO