| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide film having low hygroscopic swelling, a low coefficient of linear expansion, a low coefficient of linear expansion at a high temperature, high modulus of elasticity, and excellent environmental stability in metal peel strength when metallized. SOLUTION: This polyimide film is formed by using of a wholly aromatic tetracarboxylic acid component and a wholly aromatic diamine component as raw materials, wherein bis(trimellitic acid monoester anhydride) compounds, biphenyltetracarboxylic acids, and pyromellitic dianhydrides are contained in the wholly aromatic tetracarboxylic acid component in a ratio of 20-50 : 1-40 : 40-80 in mol%, respectively, and p-phenylenediamines and diaminodiphenyl ethers are contained in the wholly aromatic diamine component in a ratio of 25-75 : 25-75 in mol%, respectively. COPYRIGHT: (C)2004,JPO |
