| 摘要 |
PROBLEM TO BE SOLVED: To inspect various IC devices by sharing a socket board. SOLUTION: This IC socket has a three-layered structure comprising an IC device mounting part, a signal array conversion part and a socket board connection part. The IC device mounting part has IC device contact pins to be electrically connected to pin terminals of a loaded IC device, at least to the number corresponding to the pin terminals. The socket board connection part has socket board contact pins to be electrically connected to external connection terminals to the number corresponding at least to the IC device contact pins among a plurality of external connection terminals arranged on the socket board. The signal array conversion part connects electrically the IC device contact pins to the socket board contact pins. By replacing these parts in accordance with the IC device, inspection can be performed by sharing the socket board, even if not only a signal array to each pin terminal but also the number or pitches of the pin terminals are different. COPYRIGHT: (C)2004,JPO
|
