发明名称 |
Klebeverfahren und elektronisches Bauteil |
摘要 |
<p>The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to a fixed direction under the magnetic atmosphere. The invention also provides an electronic component for effectively dissipating heat generated from a semiconductor device (2), power source (4), light source or other components used for electric products, and an electronic component having excellent radiation. <IMAGE></p> |
申请公布号 |
DE60009646(D1) |
申请公布日期 |
2004.05.13 |
申请号 |
DE2000609646 |
申请日期 |
2000.12.14 |
申请人 |
POLYMATECH CO. LTD., TOKIO/TOKYO |
发明人 |
TOBITA, MASAYUKI;TATEDA, SHINYA;KIMURA, TSUNEHISA;YAMATO, MASAHUMI |
分类号 |
H01L23/40;C01B21/064;C09J5/00;C09J9/00;C09J11/04;C09J201/00;H01L21/58;(IPC1-7):C09J5/00;H01L23/373;C08K3/38;H01L23/433;H01L21/56;H01L23/495;C09J5/06 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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