发明名称 METHOD AND DEVICE FOR MOUNTING VACUUM OF MICRO ELECTRO MECHANICAL SYSTEM AT WAFER LEVEL
摘要 PURPOSE: A method and device for mounting vacuum of MEMS(micro electro mechanical system) at wafer level are provided to be capable of exactly controlling the degree of vacuum to an aiming extent and conserving initial vacuum degree in spite of the elapse of time. CONSTITUTION: A getter is attached to a cavity, wherein the cavity is formed at a cover(S310). The cover is aligned with a semiconductor substrate, wherein the semiconductor substrate is loaded in a vacuum chamber(S320). Inert gas is flowed into the vacuum chamber according to the set degree of vacuum(S330). The cover is attached to the semiconductor substrate(S340). Preferably, the getter is made of titanium. Preferably, the attaching process between the cover and the semiconductor substrate is performed, after predetermined time is passed from the inert gas inflow process.
申请公布号 KR20040040836(A) 申请公布日期 2004.05.13
申请号 KR20020069149 申请日期 2002.11.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, HYEONG;HONG, SEOK U;JUN, CHAN BONG;JUNG, GYU DONG;JUNG, SEOK HWAN;KANG, SEOK JIN;LEE, EUN SEONG;LEE, MUN CHEOL
分类号 B81C3/00;B81B7/00;H01L21/52;H01L23/02;(IPC1-7):H01L21/52 主分类号 B81C3/00
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