| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a solder resist, which has high adhesiveness, excellent acid resistance and plating resistance and good in other coating film performances, and to provide a printed wiring board using the composition. <P>SOLUTION: The photosensitive resin composition comprises: (A) an active energy ray curing resin having at least two ethylenically unsaturated bonds in one molecule; (B) a polybutadiene-based polymer compound; (C) a photopolymerization initiator; (D) a diluent; and (E) a thermosetting compound. <P>COPYRIGHT: (C)2004,JPO |
