| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for manufacturing a semiconductor element. SOLUTION: The semiconductor manufacturing device has a supporting part whereon a semiconductor substrate is put, a nozzle part for spraying fluid onto an edge part of the substrate mounted on the support part, a protective cover for preventing the fluid sprayed from the nozzle part from flowing to a protective surface of a part wherein a pattern is formed on the substrate and a protective cover moving device for moving the protective cover up and down. According to the semiconductor manufacturing device, it is possible to easily prevent chemical sprayed to an edge from flowing to a protecting surface of a wafer, when the edge of the wafer is etched. COPYRIGHT: (C)2004,JPO
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