| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and weight of an electronic circuit module that is constituted by housing a circuit board mounted with electronic components including heat generating electronic components in an enclosure while the vibration damping property and heat radiating property of the module are maintained. SOLUTION: The enclosure (composed of an enclosure base 2 and an enclosure cover 4) is made of a material containing magnesium as the main component. In addition, heat radiating films 5 composed of a material having a higher thermal radiation rate than the material composed mainly of magnesium has are formed on external surfaces of the enclosure (particularly, the enclosure base 2) so as to radiate the heat generated from a transformer 32, FET 35, etc., contained in the enclosure as the heat generating electronic components from the films 5. COPYRIGHT: (C)2004,JPO
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