发明名称 |
Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
摘要 |
A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled in the blind hole (3).
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申请公布号 |
US2004092117(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030701635 |
申请日期 |
2003.11.06 |
申请人 |
FUJIKURA LTD. |
发明人 |
SUEMASU TATSUO;TAKIZAWA TAKASHI |
分类号 |
H01L23/14;H01L21/288;H01L21/3063;H01L21/48;H01L21/768;H01L23/48;H01L25/065;(IPC1-7):H01L21/311 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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