发明名称 WAFER MAPPING SYSTEM AND METHOD
摘要 PURPOSE: A wafer mapping system and its method are provided to be capable of detecting a wafer incompletely loaded at a wafer cassette for preventing the damage of the wafer. CONSTITUTION: A wafer mapping system(310) is used for detecting a wafer(102) loaded at a wafer support part(103) of a wafer cassette(101). The wafer mapping system is provided with the first and second light emitting device(105a,105b) for irradiating light to the lateral portion of the wafer and the first and second light receiving device(106a,106b) opposite to the first and second light emitting device, respectively, for detecting the irradiated light. At this time, the first and second light emitting device are installed near both sides of the wafer support part.
申请公布号 KR20040040627(A) 申请公布日期 2004.05.13
申请号 KR20020068805 申请日期 2002.11.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SEUNG GI
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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