METHOD AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE, ELECTROOPTIC DEVICE, METHOD OF MANUFACTURING ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a novel method of mounting semiconductor device by which the reliability of conductive joints can be improved even when the numbers of wiring terminals and electrodes increase and the intervals among them become narrower, and to provide a structure for mounting the semiconductor device, an electrooptic device, and electronic equipment.

SOLUTION: Wiring terminals are formed on a wiring board and electrodes are formed in a semiconductor device. The wiring terminals are formed so that their widths may become narrower than those of the electrodes. When the semiconductor device is mounted on the wiring board, the wiring terminals bite into the electrodes due to applied pressurizing forces. It is preferable to adjust the biting amounts of the wiring terminals into the electrodes within the range of from about 1 μm to 5 μm.

COPYRIGHT: (C)2004,JPO