| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that aluminum bonding wires having diameters of≥100μm are not able to be joined firmly to the surface of the wiring layer of a wiring board. SOLUTION: The wiring board is formed of a substrate 1 composed of an electrical insulating material; the wiring layer 2 composed of at least one selected from among Au, Ag, Cu, Pd, and Pt, formed on the substrate 1 through simultaneous baking, and has areas to which the aluminum bonding wires 5 having diameters of≥100μm are joined; and coating layers 6 which are formed on the areas of the wiring layer 2 to which the bonding wires 5 are joined, has a thickness of 4-13μm, and are composed of Ni containing phosphorus at a rate of 1-5 mass%. COPYRIGHT: (C)2004,JPO |
