发明名称 |
Manufacturing methods for printed circuit boards |
摘要 |
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.
|
申请公布号 |
US2004091821(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030664996 |
申请日期 |
2003.09.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
APPELT BERND KARL-HEINZ;BUPP JAMES RUSSELL;FARQUHAR DONALD SETON;KEESLER ROSS WILLIAM;KLODOWSKI MICHAEL JOSEPH;SEMAN ANDREW MICHAEL;SCHILD GARY LEE |
分类号 |
H05K3/06;H05K3/20;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):G03C5/00;G03C5/04;H05K3/02 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|