| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor device which can save a working process, has a high moisture-absorbing effect using a moisture-absorbing agent and can reduce waste. SOLUTION: In the method for packaging a semiconductor device, the semiconductor device is housed in a tray 1 and is enclosed in a moisture-proof bag together with the tray. The packaging method comprises preparing the tray 1 having moisture absorbent holders 2 for holding the moisture-absorbing agent and a semiconductor housing part 3 for housing the semiconductor device, filling the moisture-absorbing agent in the moisture absorbent holders 2, baking the tray 1 which houses the semiconductor device in the semiconductor device housing part 3 to dry the moisture-absorbing agent and the semiconductor device, and enclosing the baked tray 1, while the semiconductor device is housed therein, into the moisture-proof bag. COPYRIGHT: (C)2004,JPO |
