| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that insulation and migration resistance lower not only in the thickness direction but also between conductors in the same plane due to thinning of an insulation layer and reduction in the wiring interval when the insulation layer of a printed board is made thinner in order to bore a smaller via hole for interlayer connection for the purpose of high density mounting. SOLUTION: Insulation reliability is ensured by inserting a thin film 4 having a high heat resistance between insulation layers 2 and leak current is reduced in the in-plane direction of an adhesive layer by making thin the entirety including the adhesive between the film 4 and a conductor layer. Insulation reliability can be sustained in both the thickness direction and the in-plane direction even with a thin insulation layer by ensuring insulation in the thickness direction with the film 4. COPYRIGHT: (C)2004,JPO |
